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Stress on Silicon Wafer

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I have a model of a silicon wafer with a labyrinth to thermally isolate the center from a section of the outside. I am wanting to know how strong the wafer will be. I initially set up a 3d model by importing a CAD file, but the degrees of freedom were too massive so i have switched to a 2D model so I could do calculations faster. However, it seems any mass placed on the chip center whatsoever causes a huge displacement, which I think has something to do with the dimensional units but I can't find out where I have gone wrong. Furthermore, the chip center is displacing in the direction opposite of where is should be (up instead of down). I am a self-taught COMSOL user and will try to answer questions as best I can, and I understand this is a simple problem so thank you for your time.

Marc


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