Hello all,
I am using COMSOL 4.4. I am simulating the effect of an incident electric field wave over a semiconductor substrate. I know the semiconductor and the RF module are not coupled through the multiphysics node, but I wanted to simulate the same model with the RF module and use the results in the semiconductor module. I was wondering if the General Extrusion was a way to go in this application by coupling two components (one using the RF module and one using the semiconductor module). However, I am not sure if this is a suitable application for the General Extrusion.
Jose Santos.