Real metal contacts to semiconductor components in model

Hello,

Let me preface this question by adding that I am a relatively novice user of COMSOL.

I am working on modelling a micron-scale device with both semiconductor and metal components. The goal is a simultanous electrical and thermal model. Hence, it is necessary (as far as I understand) to physically include actual metal contacts in the model--as opposed to using the "metal contact" boundary parameter in the semiconductor module.

For models without any semiconductor components, one can easily solve for thermal/electrical effects using the Heat Transfer in Solids and Electrical Currents/Electrostatics modules. However, the Semiconductor module appears to handle it's own electrical variables interally.

So, I am wondering: Is it possible to couple the Semiconductor and Electric Currents/Electrostatics modules in order to model a device with both semiconductor and metal components?

Thanks in advance, Ara